Instituto Nokia de Tecnologia

J. Varghese, G. Sobue, D. Farley, G. Freitas, A. Dasgupta, "Guidelines for Transient Modeling of Board Level Drop Tests", NAFEMS World Congress 2007, May 22-25, Vancouver, Canada.

SILVA, O. C., Synthetics vs. biomaterials: an overview focused on energy consumption. In: PPS 23 - The Polymer Processing Society 23rd Annual Meeting, Salvador/BA, Brazil, 2007 (in progress).

SILVA, O. C., Logistical chain for synthetic and bio-based materials: environmental impact focused on energy consumption. In: 14th International Annual EurOMA Conference, Ankara, Turkey, 2007 (in progress).

SILVA, O. C. & Dacol, S., Logistical chains in the Amazon: environmental impact focused on energy consumption. In: ICPR 19 - 19th International Conference on Production Research, Valparaiso, Chile, 2007 (in progress).

W. Peng, E. F. Monlevade, M. E. Marques, "Interfacial structure and Cu3Sn growth kinetics in Cu/SnAgCu/Cu solder joints after aging".

W. Peng, M. E. Marques, "Effect of Thermal Aging on Drop Performance of CSP with Cu/SnAgCu Solder Joints".

MARQUES, M. E. ; Monlevade, E.F. ; PENG, W. . Effect of Thermal Aging on Electrical Resistance of SnAgCu/Cu Joints. In: 39th International Symposium on Microelectronics, 2006, San Diego. Proceedings of the 39th International Symposium on Microelectronics, 2006.

M. Hossain, V. Puligandla, D. Agonafer, T. Reinikainen, ''Deformation Characteristics and Constitutive Relationship of SnAgCu Lead (Pb)-Free Solder Alloys under Thermo-mechanical and Mechanical Loading'', ASME IMECE 2006 Conference, Nov 5-10, Chicago, USA.

L. Jannesari, A. Dasgupta, I. Cardoso, T. Reinikainen, "Effect of manufacturing variability on reliability of lead free solder joints", ASME IMECE conference 2006.

D. C. Rolim, E. F. Monlevade, O. C. Silva, "Solidification Structures of Sn-CU and Sn-Ag-Cu alloys after air cooling"; Micromat/SBPMat conference - October 8th-12th 2006.

D. C. Rolim, E. F. Monlevade, O. C. Silva, "Solidification Structures of Sn-CU and Sn-Ag-Cu alloys after furnace cooling"; Micromat/SBPMat conference - October 8th-12th 2006.

Marco E. Marques, E.F. Monlevade, W.Peng, "Effect of thermal aging on electrical resistance of SnAgCu/Cu joints", IMAPS 2006 on Jan/2006.

E. F. Monlevade, T. Reinikainen, "Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects", March 30th 2006 for HDP06 - Shanghai, China.

T. Reinikainen, P. MarjamÀE. Monlevade, J.K. Kivilahti, 'Microstructure and Mechanics of SnAgCu Solder Alloys', EuroSimE 2005, April 18-20, Berlin, 2005.

Z. Han, L. Xu, B. Wang, T. Reinikainen, 'A Novel Response Surface Method for Simulation-based Design Optimizations of Electronic Packages', EuroSimE 2005, April 18-20, Berlin, 2005.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . RISK BASED DECISION MAKING APPLIED TO MAINTENANCE POLICY SELECTION. In: XVIII COBEM - International Congress of Mechanical Engineering, 2005, Ouro Preto. Proceedings of the COBEM 2005. v. 2005.

L. Xu, T. Reinikainen, W. Ren, B. Wang, Z. Han, D. Agonafer, "A Simulation-based Multi-objective Design Optimization of Electronic Packages under Thermal Cycling and Bending", Microelectronic Reliability, 44 (2004) 1977 - 1983.

S. Canumalla, H.-D. Yang, V. Puligandla, T. Reinikainen, 'Package to Board Interconnection Shear Strength (PBISS): Effect of Surface Finish, PWB Build-Up Layer and Chip Scale Package Structure', IEEE Trans. on Components and Packaging Technologies, Vol. 27, No.1, 2004, pp. 182-190.

M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, 'Strain Based Approach for Predicting the Solder Joint Fatigue Life with the Addition of Intermetallic Compound Using the Finite-Element Method', ITHERM04, June 1-4, 2004 in Las Vegas, Nevada, USA.

Z. Han, L. Xu, W. Ren, B. Wang, T. Reinikainen, "Reliability-Based Optimization for Land Grid Array Solder Joints under Thermo-Mechanical Load", EuroSimE 2004, Brussels, Belgium, pp.219-224.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Reliability Based Maintenance: Science and Practical issues. Boletim técnico da Escola Politécnica da USP. BT/PMR, v. 0412, p. 1-12, 2004.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Reliability Based Maintenance: Science and Solutions. In: I Simpósio Internacional de Confiabilidade, 2004, São Paulo. Proceedings of the SIC 2004. v. 2004. p. 1-14.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Impact properties of injection molded PP/HDPE blends. In: PPS 2004 - Americas Regional Meeting, Florianopolis/ SC, Brazil, 2004.

S. Shetty and T. Reinikainen, 'Three- and Four-point Bend Testing of Electronic Assemblies', Trans. ASME J. Elec. Pack., Vol. 125, Dec 2003.

M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, 'The Role of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modelling', July 6-11, InterPack '03, Maui, 2003.

S. Canumalla and T. Reinikainen, 'On Damage Accumulation and Microcrack Nucleation in Solder under an Applied Shear Stress Field', ECTC 2003, May 27-30, New Orleans, USA, 2003.

J. Wang, J. Zhu, S. Quander, T. Reinikainen, and V. Puligandla, 'Microvia Fatigue Life Prediction under Thermal-Mechanical Cyclic Loading Condition', NEPCON WEST 2002, December 13-17, San Jose, USA, 2002.

A. Kujala, T. Reinikainen, and W. Ren, 'Transition to Pb-free Manufacturing Using Land Grid Array Packaging Technology', ECTC 2002, May 28-31, San Diego, 2002.

B. Rodgers, J. Punch, J. Jarvis, P. Myllykoski, and T. Reinikainen, 'Finite-element Modeling of a BGA Package Subjected to Thermal and Power Cycling', ITHERM 2002

CARDOSO, I. A. P. ; SOUZA, G. F. M. ; BELHOT, R. V. . Aplicação do Método de Decisão AHP para Seleção da Política de Manutenção de Sistemas Mecânicos (AHP Decision Making Method application to select Maintenance Policies for Mechanical Systems). In: Congresso Nacional de Engenharia Mecânica, 2002, João Pessoa, 2002.

FREITAS, G. G. . Parametric optimization of stayed bridges. In: Encontro de Usuários de Ansys 2002 Smarttech, 2002, São Paulo. Encontro de Usuários de Ansys 2002 Smarttech, 2002.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Stability of polypropylene submitted to multiple extrusion cycles. In: CBECIMAT - Congresso Brasileiro de Engenharia e Ciencia dos Materiais, Natal/RN, Brazil, 2002.

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, and T. Reinikainen, 'Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending', Trans. ASME J. Elec Pack, Vol. 123, Sept, 2001, pp 302-308.

T. Reinikainen and W. Ren, 'An Optimized Shear Test Sample for Assessing Solder Deformation Properties', EuroSimE 2001, April 9-12, Paris, 2001.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . Design of Housing for Safety Valves. 2001.

CARDOSO, I. A. P. . Maintenance Planning for Food Processing Plant. 2001.

FREITAS, G. G. . Automation of the structural verification of gantry cranes. In: Encontro de Usuários de Ansys 2001 Smarttech, 2001, São Paulo. Encontro de Usuários de Ansys 2001 Smarttech, 2001.

FREITAS, G. G. ; COLALILLO, R. . Optimization of metallic structures. In: Congresso SAE 2001, 2001, São Paulo. Congresso SAE 2001, 2001.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Impact properties of injection molded polyolefins. In: Congresso Brasileiro de Polimeros/ International Macromolecular Colloquium, Gramado/ RS, Brazil. CD ROM, ABPOL, 2001.

J. Varghese, G. Sobue, D. Farley, G. Freitas, A. Dasgupta, "Guidelines for Transient Modeling of Board Level Drop Tests", NAFEMS World Congress 2007, May 22-25, Vancouver, Canada.

SILVA, O. C., Synthetics vs. biomaterials: an overview focused on energy consumption. In: PPS 23 - The Polymer Processing Society 23rd Annual Meeting, Salvador/BA, Brazil, 2007 (in progress).

SILVA, O. C., Logistical chain for synthetic and bio-based materials: environmental impact focused on energy consumption. In: 14th International Annual EurOMA Conference, Ankara, Turkey, 2007 (in progress).

SILVA, O. C. & Dacol, S., Logistical chains in the Amazon: environmental impact focused on energy consumption. In: ICPR 19 - 19th International Conference on Production Research, Valparaiso, Chile, 2007 (in progress).

W. Peng, E. F. Monlevade, M. E. Marques, "Interfacial structure and Cu3Sn growth kinetics in Cu/SnAgCu/Cu solder joints after aging".

W. Peng, M. E. Marques, "Effect of Thermal Aging on Drop Performance of CSP with Cu/SnAgCu Solder Joints".

MARQUES, M. E. ; Monlevade, E.F. ; PENG, W. . Effect of Thermal Aging on Electrical Resistance of SnAgCu/Cu Joints. In: 39th International Symposium on Microelectronics, 2006, San Diego. Proceedings of the 39th International Symposium on Microelectronics, 2006.

M. Hossain, V. Puligandla, D. Agonafer, T. Reinikainen, ''Deformation Characteristics and Constitutive Relationship of SnAgCu Lead (Pb)-Free Solder Alloys under Thermo-mechanical and Mechanical Loading'', ASME IMECE 2006 Conference, Nov 5-10, Chicago, USA.

L. Jannesari, A. Dasgupta, I. Cardoso, T. Reinikainen, "Effect of manufacturing variability on reliability of lead free solder joints", ASME IMECE conference 2006.

D. C. Rolim, E. F. Monlevade, O. C. Silva, "Solidification Structures of Sn-CU and Sn-Ag-Cu alloys after air cooling"; Micromat/SBPMat conference - October 8th-12th 2006.

D. C. Rolim, E. F. Monlevade, O. C. Silva, "Solidification Structures of Sn-CU and Sn-Ag-Cu alloys after furnace cooling"; Micromat/SBPMat conference - October 8th-12th 2006.

Marco E. Marques, E.F. Monlevade, W.Peng, "Effect of thermal aging on electrical resistance of SnAgCu/Cu joints", IMAPS 2006 on Jan/2006.

E. F. Monlevade, T. Reinikainen, "Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects", March 30th 2006 for HDP06 - Shanghai, China.

T. Reinikainen, P. MarjamÀE. Monlevade, J.K. Kivilahti, 'Microstructure and Mechanics of SnAgCu Solder Alloys', EuroSimE 2005, April 18-20, Berlin, 2005.

Z. Han, L. Xu, B. Wang, T. Reinikainen, 'A Novel Response Surface Method for Simulation-based Design Optimizations of Electronic Packages', EuroSimE 2005, April 18-20, Berlin, 2005.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . RISK BASED DECISION MAKING APPLIED TO MAINTENANCE POLICY SELECTION. In: XVIII COBEM - International Congress of Mechanical Engineering, 2005, Ouro Preto. Proceedings of the COBEM 2005. v. 2005.

L. Xu, T. Reinikainen, W. Ren, B. Wang, Z. Han, D. Agonafer, "A Simulation-based Multi-objective Design Optimization of Electronic Packages under Thermal Cycling and Bending", Microelectronic Reliability, 44 (2004) 1977 - 1983.

S. Canumalla, H.-D. Yang, V. Puligandla, T. Reinikainen, 'Package to Board Interconnection Shear Strength (PBISS): Effect of Surface Finish, PWB Build-Up Layer and Chip Scale Package Structure', IEEE Trans. on Components and Packaging Technologies, Vol. 27, No.1, 2004, pp. 182-190.

M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, 'Strain Based Approach for Predicting the Solder Joint Fatigue Life with the Addition of Intermetallic Compound Using the Finite-Element Method', ITHERM04, June 1-4, 2004 in Las Vegas, Nevada, USA.

Z. Han, L. Xu, W. Ren, B. Wang, T. Reinikainen, "Reliability-Based Optimization for Land Grid Array Solder Joints under Thermo-Mechanical Load", EuroSimE 2004, Brussels, Belgium, pp.219-224.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Reliability Based Maintenance: Science and Practical issues. Boletim técnico da Escola Politécnica da USP. BT/PMR, v. 0412, p. 1-12, 2004.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Reliability Based Maintenance: Science and Solutions. In: I Simpósio Internacional de Confiabilidade, 2004, São Paulo. Proceedings of the SIC 2004. v. 2004. p. 1-14.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Impact properties of injection molded PP/HDPE blends. In: PPS 2004 - Americas Regional Meeting, Florianopolis/ SC, Brazil, 2004.

S. Shetty and T. Reinikainen, 'Three- and Four-point Bend Testing of Electronic Assemblies', Trans. ASME J. Elec. Pack., Vol. 125, Dec 2003.

M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, 'The Role of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modelling', July 6-11, InterPack '03, Maui, 2003.

S. Canumalla and T. Reinikainen, 'On Damage Accumulation and Microcrack Nucleation in Solder under an Applied Shear Stress Field', ECTC 2003, May 27-30, New Orleans, USA, 2003.

J. Wang, J. Zhu, S. Quander, T. Reinikainen, and V. Puligandla, 'Microvia Fatigue Life Prediction under Thermal-Mechanical Cyclic Loading Condition', NEPCON WEST 2002, December 13-17, San Jose, USA, 2002.

A. Kujala, T. Reinikainen, and W. Ren, 'Transition to Pb-free Manufacturing Using Land Grid Array Packaging Technology', ECTC 2002, May 28-31, San Diego, 2002.

B. Rodgers, J. Punch, J. Jarvis, P. Myllykoski, and T. Reinikainen, 'Finite-element Modeling of a BGA Package Subjected to Thermal and Power Cycling', ITHERM 2002

CARDOSO, I. A. P. ; SOUZA, G. F. M. ; BELHOT, R. V. . Aplicação do Método de Decisão AHP para Seleção da Política de Manutenção de Sistemas Mecânicos (AHP Decision Making Method application to select Maintenance Policies for Mechanical Systems). In: Congresso Nacional de Engenharia Mecânica, 2002, João Pessoa, 2002.

FREITAS, G. G. . Parametric optimization of stayed bridges. In: Encontro de Usuários de Ansys 2002 Smarttech, 2002, São Paulo. Encontro de Usuários de Ansys 2002 Smarttech, 2002.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Stability of polypropylene submitted to multiple extrusion cycles. In: CBECIMAT - Congresso Brasileiro de Engenharia e Ciencia dos Materiais, Natal/RN, Brazil, 2002.

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, and T. Reinikainen, 'Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending', Trans. ASME J. Elec Pack, Vol. 123, Sept, 2001, pp 302-308.

T. Reinikainen and W. Ren, 'An Optimized Shear Test Sample for Assessing Solder Deformation Properties', EuroSimE 2001, April 9-12, Paris, 2001.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . Design of Housing for Safety Valves. 2001.

CARDOSO, I. A. P. . Maintenance Planning for Food Processing Plant. 2001.

FREITAS, G. G. . Automation of the structural verification of gantry cranes. In: Encontro de Usuários de Ansys 2001 Smarttech, 2001, São Paulo. Encontro de Usuários de Ansys 2001 Smarttech, 2001.

FREITAS, G. G. ; COLALILLO, R. . Optimization of metallic structures. In: Congresso SAE 2001, 2001, São Paulo. Congresso SAE 2001, 2001.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Impact properties of injection molded polyolefins. In: Congresso Brasileiro de Polimeros/ International Macromolecular Colloquium, Gramado/ RS, Brazil. CD ROM, ABPOL, 2001.

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, T. Reinikainen, 'Effect of Bending on Chip Scale Package Interconnects', Trans. ASME J. Elec. Pack., Vol. 122, June, 2000.

V. Pennanen, M. Tammenmaa, T. Reinikainen, J. Zhu, W. Lin, 'TBGA Reliability in Telecom Environment', Soldering and Surface Mount Technology, Vol. 12, No. 2, 2000, pp. 42-46.

J.H. Okura, S. Shetty, B. Ramakrishnan, A. Dasgupta, J. F. J. M. Caers, and T. Reinikainen, 'Guidelines to Select Underfills for Flip Chip on Board Assemblies and Compliant Interposers for Chip Scale Package Assemblies', Special Issue of: Microelectronics Reliability Journal, March, 2000.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Realibility Concepts Applied to Failure Analysis and Maintenance Policies Elaboration. Boletim técnico da Escola Politécnica da USP. BT/PMR, v. 0010, p. 1-12, 2000.

FREITAS, G. G. . Tridimensional parametric analysis of hydraulic gates Análise Paramétrica Tridimensional de Comportas Hidráulicas. In: 18o Congresso Nacional de Transportes Marítimos e Construção Naval e Offshore 2000, 2000, Rio de Janeiro. 18o Congresso Nacional de Transportes Marítimos e Construção Naval e Offshore 2000, 2000.

FREITAS, G. G. . Parametric Model Generator for Opening in Submarines Structural Hulls. In: Computational Methods for Shell and Spatial Structures IASS-IACM 2000, 2000. Computational Methods for Shell and Spatial Structures IASS-IACM 2000, 2000.

J. Varghese, G. Sobue, D. Farley, G. Freitas, A. Dasgupta, "Guidelines for Transient Modeling of Board Level Drop Tests", NAFEMS World Congress 2007, May 22-25, Vancouver, Canada.

SILVA, O. C., Synthetics vs. biomaterials: an overview focused on energy consumption. In: PPS 23 - The Polymer Processing Society 23rd Annual Meeting, Salvador/BA, Brazil, 2007 (in progress).

SILVA, O. C., Logistical chain for synthetic and bio-based materials: environmental impact focused on energy consumption. In: 14th International Annual EurOMA Conference, Ankara, Turkey, 2007 (in progress).

SILVA, O. C. & Dacol, S., Logistical chains in the Amazon: environmental impact focused on energy consumption. In: ICPR 19 - 19th International Conference on Production Research, Valparaiso, Chile, 2007 (in progress).

W. Peng, E. F. Monlevade, M. E. Marques, "Interfacial structure and Cu3Sn growth kinetics in Cu/SnAgCu/Cu solder joints after aging".

W. Peng, M. E. Marques, "Effect of Thermal Aging on Drop Performance of CSP with Cu/SnAgCu Solder Joints".

MARQUES, M. E. ; Monlevade, E.F. ; PENG, W. . Effect of Thermal Aging on Electrical Resistance of SnAgCu/Cu Joints. In: 39th International Symposium on Microelectronics, 2006, San Diego. Proceedings of the 39th International Symposium on Microelectronics, 2006.

M. Hossain, V. Puligandla, D. Agonafer, T. Reinikainen, ''Deformation Characteristics and Constitutive Relationship of SnAgCu Lead (Pb)-Free Solder Alloys under Thermo-mechanical and Mechanical Loading'', ASME IMECE 2006 Conference, Nov 5-10, Chicago, USA.

L. Jannesari, A. Dasgupta, I. Cardoso, T. Reinikainen, "Effect of manufacturing variability on reliability of lead free solder joints", ASME IMECE conference 2006.

D. C. Rolim, E. F. Monlevade, O. C. Silva, "Solidification Structures of Sn-CU and Sn-Ag-Cu alloys after air cooling"; Micromat/SBPMat conference - October 8th-12th 2006.

D. C. Rolim, E. F. Monlevade, O. C. Silva, "Solidification Structures of Sn-CU and Sn-Ag-Cu alloys after furnace cooling"; Micromat/SBPMat conference - October 8th-12th 2006.

Marco E. Marques, E.F. Monlevade, W.Peng, "Effect of thermal aging on electrical resistance of SnAgCu/Cu joints", IMAPS 2006 on Jan/2006.

E. F. Monlevade, T. Reinikainen, "Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects", March 30th 2006 for HDP06 - Shanghai, China.

T. Reinikainen, P. MarjamÀE. Monlevade, J.K. Kivilahti, 'Microstructure and Mechanics of SnAgCu Solder Alloys', EuroSimE 2005, April 18-20, Berlin, 2005.

Z. Han, L. Xu, B. Wang, T. Reinikainen, 'A Novel Response Surface Method for Simulation-based Design Optimizations of Electronic Packages', EuroSimE 2005, April 18-20, Berlin, 2005.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . RISK BASED DECISION MAKING APPLIED TO MAINTENANCE POLICY SELECTION. In: XVIII COBEM - International Congress of Mechanical Engineering, 2005, Ouro Preto. Proceedings of the COBEM 2005. v. 2005.

L. Xu, T. Reinikainen, W. Ren, B. Wang, Z. Han, D. Agonafer, "A Simulation-based Multi-objective Design Optimization of Electronic Packages under Thermal Cycling and Bending", Microelectronic Reliability, 44 (2004) 1977 - 1983.

S. Canumalla, H.-D. Yang, V. Puligandla, T. Reinikainen, 'Package to Board Interconnection Shear Strength (PBISS): Effect of Surface Finish, PWB Build-Up Layer and Chip Scale Package Structure', IEEE Trans. on Components and Packaging Technologies, Vol. 27, No.1, 2004, pp. 182-190.

M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, 'Strain Based Approach for Predicting the Solder Joint Fatigue Life with the Addition of Intermetallic Compound Using the Finite-Element Method', ITHERM04, June 1-4, 2004 in Las Vegas, Nevada, USA.

Z. Han, L. Xu, W. Ren, B. Wang, T. Reinikainen, "Reliability-Based Optimization for Land Grid Array Solder Joints under Thermo-Mechanical Load", EuroSimE 2004, Brussels, Belgium, pp.219-224.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Reliability Based Maintenance: Science and Practical issues. Boletim técnico da Escola Politécnica da USP. BT/PMR, v. 0412, p. 1-12, 2004.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Reliability Based Maintenance: Science and Solutions. In: I Simpósio Internacional de Confiabilidade, 2004, São Paulo. Proceedings of the SIC 2004. v. 2004. p. 1-14.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Impact properties of injection molded PP/HDPE blends. In: PPS 2004 - Americas Regional Meeting, Florianopolis/ SC, Brazil, 2004.

S. Shetty and T. Reinikainen, 'Three- and Four-point Bend Testing of Electronic Assemblies', Trans. ASME J. Elec. Pack., Vol. 125, Dec 2003.

M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, 'The Role of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modelling', July 6-11, InterPack '03, Maui, 2003.

S. Canumalla and T. Reinikainen, 'On Damage Accumulation and Microcrack Nucleation in Solder under an Applied Shear Stress Field', ECTC 2003, May 27-30, New Orleans, USA, 2003.

J. Wang, J. Zhu, S. Quander, T. Reinikainen, and V. Puligandla, 'Microvia Fatigue Life Prediction under Thermal-Mechanical Cyclic Loading Condition', NEPCON WEST 2002, December 13-17, San Jose, USA, 2002.

A. Kujala, T. Reinikainen, and W. Ren, 'Transition to Pb-free Manufacturing Using Land Grid Array Packaging Technology', ECTC 2002, May 28-31, San Diego, 2002.

B. Rodgers, J. Punch, J. Jarvis, P. Myllykoski, and T. Reinikainen, 'Finite-element Modeling of a BGA Package Subjected to Thermal and Power Cycling', ITHERM 2002

CARDOSO, I. A. P. ; SOUZA, G. F. M. ; BELHOT, R. V. . Aplicação do Método de Decisão AHP para Seleção da Política de Manutenção de Sistemas Mecânicos (AHP Decision Making Method application to select Maintenance Policies for Mechanical Systems). In: Congresso Nacional de Engenharia Mecânica, 2002, João Pessoa, 2002.

FREITAS, G. G. . Parametric optimization of stayed bridges. In: Encontro de Usuários de Ansys 2002 Smarttech, 2002, São Paulo. Encontro de Usuários de Ansys 2002 Smarttech, 2002.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Stability of polypropylene submitted to multiple extrusion cycles. In: CBECIMAT - Congresso Brasileiro de Engenharia e Ciencia dos Materiais, Natal/RN, Brazil, 2002.

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, and T. Reinikainen, 'Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending', Trans. ASME J. Elec Pack, Vol. 123, Sept, 2001, pp 302-308.

T. Reinikainen and W. Ren, 'An Optimized Shear Test Sample for Assessing Solder Deformation Properties', EuroSimE 2001, April 9-12, Paris, 2001.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . Design of Housing for Safety Valves. 2001.

CARDOSO, I. A. P. . Maintenance Planning for Food Processing Plant. 2001.

FREITAS, G. G. . Automation of the structural verification of gantry cranes. In: Encontro de Usuários de Ansys 2001 Smarttech, 2001, São Paulo. Encontro de Usuários de Ansys 2001 Smarttech, 2001.

FREITAS, G. G. ; COLALILLO, R. . Optimization of metallic structures. In: Congresso SAE 2001, 2001, São Paulo. Congresso SAE 2001, 2001.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Impact properties of injection molded polyolefins. In: Congresso Brasileiro de Polimeros/ International Macromolecular Colloquium, Gramado/ RS, Brazil. CD ROM, ABPOL, 2001.

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, T. Reinikainen, 'Effect of Bending on Chip Scale Package Interconnects', Trans. ASME J. Elec. Pack., Vol. 122, June, 2000.

V. Pennanen, M. Tammenmaa, T. Reinikainen, J. Zhu, W. Lin, 'TBGA Reliability in Telecom Environment', Soldering and Surface Mount Technology, Vol. 12, No. 2, 2000, pp. 42-46.

J.H. Okura, S. Shetty, B. Ramakrishnan, A. Dasgupta, J. F. J. M. Caers, and T. Reinikainen, 'Guidelines to Select Underfills for Flip Chip on Board Assemblies and Compliant Interposers for Chip Scale Package Assemblies', Special Issue of: Microelectronics Reliability Journal, March, 2000.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Realibility Concepts Applied to Failure Analysis and Maintenance Policies Elaboration. Boletim técnico da Escola Politécnica da USP. BT/PMR, v. 0010, p. 1-12, 2000.

FREITAS, G. G. . Tridimensional parametric analysis of hydraulic gates Análise Paramétrica Tridimensional de Comportas Hidráulicas. In: 18o Congresso Nacional de Transportes Marítimos e Construção Naval e Offshore 2000, 2000, Rio de Janeiro. 18o Congresso Nacional de Transportes Marítimos e Construção Naval e Offshore 2000, 2000.

FREITAS, G. G. . Parametric Model Generator for Opening in Submarines Structural Hulls. In: Computational Methods for Shell and Spatial Structures IASS-IACM 2000, 2000. Computational Methods for Shell and Spatial Structures IASS-IACM 2000, 2000.

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J.F.J.M. Caers, 'Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2 - With Underfill', Trans. ASME J. Elec. Pack., December, 1999, Vol. 121, pp. 237-241.

K. Darbha, J. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. Caers, éEffect of Curing-Induced Hydrostatic Stresses on Life of Underfilled Area-Array Solder Interconnectsé, InterPACK é99, June 13-19, Hawaii, 1999, pp. 1913-1920.

T. Reinikainen and J. Kivilahti, éDeformation Behaviour of Dilute SnBi(0.5...6at%) Solid Solutionsé, Metallurgical and Materials Transactions A, Vol. 30A, January, 1999, pp. 123-132.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . Reliability Based Maintenance: Science and Solutions. In: XI Congresso Brasileiro de Engenharia Mecânica, 1999, Águas de Lindóia, 1999.

FREITAS, G. G. . Parametric finite element model of hydraulic gates and overhead cranes. 1997.

SILVA, O. C., Freire, J. T., Study on thermal behavior of post-consume poliethylene terephtalate (PET) bottles for recycling. In: Congresso Brasileiro de Sistemas Particulados, Sao Carlos/ SP, Brazil, 1997.

T. Reinikainen, F.W. Wulff, W. Kolbe and T. Ahrens,éA new method to determine crack shape and size in solder jointsé, Trans. ASME J. Elec. Pack., Vol. 117, December, pp. 266-269, 1995.

J. Varghese, G. Sobue, D. Farley, G. Freitas, A. Dasgupta, "Guidelines for Transient Modeling of Board Level Drop Tests", NAFEMS World Congress 2007, May 22-25, Vancouver, Canada.

SILVA, O. C., Synthetics vs. biomaterials: an overview focused on energy consumption. In: PPS 23 - The Polymer Processing Society 23rd Annual Meeting, Salvador/BA, Brazil, 2007 (in progress).

SILVA, O. C., Logistical chain for synthetic and bio-based materials: environmental impact focused on energy consumption. In: 14th International Annual EurOMA Conference, Ankara, Turkey, 2007 (in progress).

SILVA, O. C. & Dacol, S., Logistical chains in the Amazon: environmental impact focused on energy consumption. In: ICPR 19 - 19th International Conference on Production Research, Valparaiso, Chile, 2007 (in progress).

W. Peng, E. F. Monlevade, M. E. Marques, "Interfacial structure and Cu3Sn growth kinetics in Cu/SnAgCu/Cu solder joints after aging".

W. Peng, M. E. Marques, "Effect of Thermal Aging on Drop Performance of CSP with Cu/SnAgCu Solder Joints".

MARQUES, M. E. ; Monlevade, E.F. ; PENG, W. . Effect of Thermal Aging on Electrical Resistance of SnAgCu/Cu Joints. In: 39th International Symposium on Microelectronics, 2006, San Diego. Proceedings of the 39th International Symposium on Microelectronics, 2006.

M. Hossain, V. Puligandla, D. Agonafer, T. Reinikainen, ''Deformation Characteristics and Constitutive Relationship of SnAgCu Lead (Pb)-Free Solder Alloys under Thermo-mechanical and Mechanical Loading'', ASME IMECE 2006 Conference, Nov 5-10, Chicago, USA.

L. Jannesari, A. Dasgupta, I. Cardoso, T. Reinikainen, "Effect of manufacturing variability on reliability of lead free solder joints", ASME IMECE conference 2006.

D. C. Rolim, E. F. Monlevade, O. C. Silva, "Solidification Structures of Sn-CU and Sn-Ag-Cu alloys after air cooling"; Micromat/SBPMat conference - October 8th-12th 2006.

D. C. Rolim, E. F. Monlevade, O. C. Silva, "Solidification Structures of Sn-CU and Sn-Ag-Cu alloys after furnace cooling"; Micromat/SBPMat conference - October 8th-12th 2006.

Marco E. Marques, E.F. Monlevade, W.Peng, "Effect of thermal aging on electrical resistance of SnAgCu/Cu joints", IMAPS 2006 on Jan/2006.

E. F. Monlevade, T. Reinikainen, "Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects", March 30th 2006 for HDP06 - Shanghai, China.

T. Reinikainen, P. MarjamÀE. Monlevade, J.K. Kivilahti, 'Microstructure and Mechanics of SnAgCu Solder Alloys', EuroSimE 2005, April 18-20, Berlin, 2005.

Z. Han, L. Xu, B. Wang, T. Reinikainen, 'A Novel Response Surface Method for Simulation-based Design Optimizations of Electronic Packages', EuroSimE 2005, April 18-20, Berlin, 2005.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . RISK BASED DECISION MAKING APPLIED TO MAINTENANCE POLICY SELECTION. In: XVIII COBEM - International Congress of Mechanical Engineering, 2005, Ouro Preto. Proceedings of the COBEM 2005. v. 2005.

L. Xu, T. Reinikainen, W. Ren, B. Wang, Z. Han, D. Agonafer, "A Simulation-based Multi-objective Design Optimization of Electronic Packages under Thermal Cycling and Bending", Microelectronic Reliability, 44 (2004) 1977 - 1983.

S. Canumalla, H.-D. Yang, V. Puligandla, T. Reinikainen, 'Package to Board Interconnection Shear Strength (PBISS): Effect of Surface Finish, PWB Build-Up Layer and Chip Scale Package Structure', IEEE Trans. on Components and Packaging Technologies, Vol. 27, No.1, 2004, pp. 182-190.

M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, 'Strain Based Approach for Predicting the Solder Joint Fatigue Life with the Addition of Intermetallic Compound Using the Finite-Element Method', ITHERM04, June 1-4, 2004 in Las Vegas, Nevada, USA.

Z. Han, L. Xu, W. Ren, B. Wang, T. Reinikainen, "Reliability-Based Optimization for Land Grid Array Solder Joints under Thermo-Mechanical Load", EuroSimE 2004, Brussels, Belgium, pp.219-224.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Reliability Based Maintenance: Science and Practical issues. Boletim técnico da Escola Politécnica da USP. BT/PMR, v. 0412, p. 1-12, 2004.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Reliability Based Maintenance: Science and Solutions. In: I Simpósio Internacional de Confiabilidade, 2004, São Paulo. Proceedings of the SIC 2004. v. 2004. p. 1-14.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Impact properties of injection molded PP/HDPE blends. In: PPS 2004 - Americas Regional Meeting, Florianopolis/ SC, Brazil, 2004.

S. Shetty and T. Reinikainen, 'Three- and Four-point Bend Testing of Electronic Assemblies', Trans. ASME J. Elec. Pack., Vol. 125, Dec 2003.

M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, 'The Role of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modelling', July 6-11, InterPack '03, Maui, 2003.

S. Canumalla and T. Reinikainen, 'On Damage Accumulation and Microcrack Nucleation in Solder under an Applied Shear Stress Field', ECTC 2003, May 27-30, New Orleans, USA, 2003.

J. Wang, J. Zhu, S. Quander, T. Reinikainen, and V. Puligandla, 'Microvia Fatigue Life Prediction under Thermal-Mechanical Cyclic Loading Condition', NEPCON WEST 2002, December 13-17, San Jose, USA, 2002.

A. Kujala, T. Reinikainen, and W. Ren, 'Transition to Pb-free Manufacturing Using Land Grid Array Packaging Technology', ECTC 2002, May 28-31, San Diego, 2002.

B. Rodgers, J. Punch, J. Jarvis, P. Myllykoski, and T. Reinikainen, 'Finite-element Modeling of a BGA Package Subjected to Thermal and Power Cycling', ITHERM 2002

CARDOSO, I. A. P. ; SOUZA, G. F. M. ; BELHOT, R. V. . Aplicação do Método de Decisão AHP para Seleção da Política de Manutenção de Sistemas Mecânicos (AHP Decision Making Method application to select Maintenance Policies for Mechanical Systems). In: Congresso Nacional de Engenharia Mecânica, 2002, João Pessoa, 2002.

FREITAS, G. G. . Parametric optimization of stayed bridges. In: Encontro de Usuários de Ansys 2002 Smarttech, 2002, São Paulo. Encontro de Usuários de Ansys 2002 Smarttech, 2002.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Stability of polypropylene submitted to multiple extrusion cycles. In: CBECIMAT - Congresso Brasileiro de Engenharia e Ciencia dos Materiais, Natal/RN, Brazil, 2002.

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, and T. Reinikainen, 'Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending', Trans. ASME J. Elec Pack, Vol. 123, Sept, 2001, pp 302-308.

T. Reinikainen and W. Ren, 'An Optimized Shear Test Sample for Assessing Solder Deformation Properties', EuroSimE 2001, April 9-12, Paris, 2001.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . Design of Housing for Safety Valves. 2001.

CARDOSO, I. A. P. . Maintenance Planning for Food Processing Plant. 2001.

FREITAS, G. G. . Automation of the structural verification of gantry cranes. In: Encontro de Usuários de Ansys 2001 Smarttech, 2001, São Paulo. Encontro de Usuários de Ansys 2001 Smarttech, 2001.

FREITAS, G. G. ; COLALILLO, R. . Optimization of metallic structures. In: Congresso SAE 2001, 2001, São Paulo. Congresso SAE 2001, 2001.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Impact properties of injection molded polyolefins. In: Congresso Brasileiro de Polimeros/ International Macromolecular Colloquium, Gramado/ RS, Brazil. CD ROM, ABPOL, 2001.

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, T. Reinikainen, 'Effect of Bending on Chip Scale Package Interconnects', Trans. ASME J. Elec. Pack., Vol. 122, June, 2000.

V. Pennanen, M. Tammenmaa, T. Reinikainen, J. Zhu, W. Lin, 'TBGA Reliability in Telecom Environment', Soldering and Surface Mount Technology, Vol. 12, No. 2, 2000, pp. 42-46.

J.H. Okura, S. Shetty, B. Ramakrishnan, A. Dasgupta, J. F. J. M. Caers, and T. Reinikainen, 'Guidelines to Select Underfills for Flip Chip on Board Assemblies and Compliant Interposers for Chip Scale Package Assemblies', Special Issue of: Microelectronics Reliability Journal, March, 2000.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Realibility Concepts Applied to Failure Analysis and Maintenance Policies Elaboration. Boletim técnico da Escola Politécnica da USP. BT/PMR, v. 0010, p. 1-12, 2000.

FREITAS, G. G. . Tridimensional parametric analysis of hydraulic gates Análise Paramétrica Tridimensional de Comportas Hidráulicas. In: 18o Congresso Nacional de Transportes Marítimos e Construção Naval e Offshore 2000, 2000, Rio de Janeiro. 18o Congresso Nacional de Transportes Marítimos e Construção Naval e Offshore 2000, 2000.

FREITAS, G. G. . Parametric Model Generator for Opening in Submarines Structural Hulls. In: Computational Methods for Shell and Spatial Structures IASS-IACM 2000, 2000. Computational Methods for Shell and Spatial Structures IASS-IACM 2000, 2000.

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J.F.J.M. Caers, 'Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2 - With Underfill', Trans. ASME J. Elec. Pack., December, 1999, Vol. 121, pp. 237-241.

K. Darbha, J. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. Caers, éEffect of Curing-Induced Hydrostatic Stresses on Life of Underfilled Area-Array Solder Interconnectsé, InterPACK é99, June 13-19, Hawaii, 1999, pp. 1913-1920.

T. Reinikainen and J. Kivilahti, éDeformation Behaviour of Dilute SnBi(0.5...6at%) Solid Solutionsé, Metallurgical and Materials Transactions A, Vol. 30A, January, 1999, pp. 123-132.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . Reliability Based Maintenance: Science and Solutions. In: XI Congresso Brasileiro de Engenharia Mecânica, 1999, Águas de Lindóia, 1999.

FREITAS, G. G. . Parametric finite element model of hydraulic gates and overhead cranes. 1997.

SILVA, O. C., Freire, J. T., Study on thermal behavior of post-consume poliethylene terephtalate (PET) bottles for recycling. In: Congresso Brasileiro de Sistemas Particulados, Sao Carlos/ SP, Brazil, 1997.

T. Reinikainen, F.W. Wulff, W. Kolbe and T. Ahrens,éA new method to determine crack shape and size in solder jointsé, Trans. ASME J. Elec. Pack., Vol. 117, December, pp. 266-269, 1995.

CARDOSO, I. A. P. . Maintenance Outcomes over the Global Enterprise. Metalurgia e Materiais, São Paulo, v. 50, p. 15-18, 1994.

ROCHA, A. C., SILVA, O. C., Duarte, M. M. L., Numerical simulation of auto-catalytic reactions. In: COBEQ - Congresso Brasileiro de Engenharia Quimica, Sao Paulo/SP, Brazil, 1994.

J. Varghese, G. Sobue, D. Farley, G. Freitas, A. Dasgupta, "Guidelines for Transient Modeling of Board Level Drop Tests", NAFEMS World Congress 2007, May 22-25, Vancouver, Canada.

SILVA, O. C., Synthetics vs. biomaterials: an overview focused on energy consumption. In: PPS 23 - The Polymer Processing Society 23rd Annual Meeting, Salvador/BA, Brazil, 2007 (in progress).

SILVA, O. C., Logistical chain for synthetic and bio-based materials: environmental impact focused on energy consumption. In: 14th International Annual EurOMA Conference, Ankara, Turkey, 2007 (in progress).

SILVA, O. C. & Dacol, S., Logistical chains in the Amazon: environmental impact focused on energy consumption. In: ICPR 19 - 19th International Conference on Production Research, Valparaiso, Chile, 2007 (in progress).

W. Peng, E. F. Monlevade, M. E. Marques, "Interfacial structure and Cu3Sn growth kinetics in Cu/SnAgCu/Cu solder joints after aging".

W. Peng, M. E. Marques, "Effect of Thermal Aging on Drop Performance of CSP with Cu/SnAgCu Solder Joints".

MARQUES, M. E. ; Monlevade, E.F. ; PENG, W. . Effect of Thermal Aging on Electrical Resistance of SnAgCu/Cu Joints. In: 39th International Symposium on Microelectronics, 2006, San Diego. Proceedings of the 39th International Symposium on Microelectronics, 2006.

M. Hossain, V. Puligandla, D. Agonafer, T. Reinikainen, ''Deformation Characteristics and Constitutive Relationship of SnAgCu Lead (Pb)-Free Solder Alloys under Thermo-mechanical and Mechanical Loading'', ASME IMECE 2006 Conference, Nov 5-10, Chicago, USA.

L. Jannesari, A. Dasgupta, I. Cardoso, T. Reinikainen, "Effect of manufacturing variability on reliability of lead free solder joints", ASME IMECE conference 2006.

D. C. Rolim, E. F. Monlevade, O. C. Silva, "Solidification Structures of Sn-CU and Sn-Ag-Cu alloys after air cooling"; Micromat/SBPMat conference - October 8th-12th 2006.

D. C. Rolim, E. F. Monlevade, O. C. Silva, "Solidification Structures of Sn-CU and Sn-Ag-Cu alloys after furnace cooling"; Micromat/SBPMat conference - October 8th-12th 2006.

Marco E. Marques, E.F. Monlevade, W.Peng, "Effect of thermal aging on electrical resistance of SnAgCu/Cu joints", IMAPS 2006 on Jan/2006.

E. F. Monlevade, T. Reinikainen, "Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects", March 30th 2006 for HDP06 - Shanghai, China.

T. Reinikainen, P. MarjamÀE. Monlevade, J.K. Kivilahti, 'Microstructure and Mechanics of SnAgCu Solder Alloys', EuroSimE 2005, April 18-20, Berlin, 2005.

Z. Han, L. Xu, B. Wang, T. Reinikainen, 'A Novel Response Surface Method for Simulation-based Design Optimizations of Electronic Packages', EuroSimE 2005, April 18-20, Berlin, 2005.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . RISK BASED DECISION MAKING APPLIED TO MAINTENANCE POLICY SELECTION. In: XVIII COBEM - International Congress of Mechanical Engineering, 2005, Ouro Preto. Proceedings of the COBEM 2005. v. 2005.

L. Xu, T. Reinikainen, W. Ren, B. Wang, Z. Han, D. Agonafer, "A Simulation-based Multi-objective Design Optimization of Electronic Packages under Thermal Cycling and Bending", Microelectronic Reliability, 44 (2004) 1977 - 1983.

S. Canumalla, H.-D. Yang, V. Puligandla, T. Reinikainen, 'Package to Board Interconnection Shear Strength (PBISS): Effect of Surface Finish, PWB Build-Up Layer and Chip Scale Package Structure', IEEE Trans. on Components and Packaging Technologies, Vol. 27, No.1, 2004, pp. 182-190.

M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, 'Strain Based Approach for Predicting the Solder Joint Fatigue Life with the Addition of Intermetallic Compound Using the Finite-Element Method', ITHERM04, June 1-4, 2004 in Las Vegas, Nevada, USA.

Z. Han, L. Xu, W. Ren, B. Wang, T. Reinikainen, "Reliability-Based Optimization for Land Grid Array Solder Joints under Thermo-Mechanical Load", EuroSimE 2004, Brussels, Belgium, pp.219-224.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Reliability Based Maintenance: Science and Practical issues. Boletim técnico da Escola Politécnica da USP. BT/PMR, v. 0412, p. 1-12, 2004.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Reliability Based Maintenance: Science and Solutions. In: I Simpósio Internacional de Confiabilidade, 2004, São Paulo. Proceedings of the SIC 2004. v. 2004. p. 1-14.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Impact properties of injection molded PP/HDPE blends. In: PPS 2004 - Americas Regional Meeting, Florianopolis/ SC, Brazil, 2004.

S. Shetty and T. Reinikainen, 'Three- and Four-point Bend Testing of Electronic Assemblies', Trans. ASME J. Elec. Pack., Vol. 125, Dec 2003.

M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, 'The Role of Intermetallic Compound in Solder Joint Fatigue Life Prediction Using Finite Element Modelling', July 6-11, InterPack '03, Maui, 2003.

S. Canumalla and T. Reinikainen, 'On Damage Accumulation and Microcrack Nucleation in Solder under an Applied Shear Stress Field', ECTC 2003, May 27-30, New Orleans, USA, 2003.

J. Wang, J. Zhu, S. Quander, T. Reinikainen, and V. Puligandla, 'Microvia Fatigue Life Prediction under Thermal-Mechanical Cyclic Loading Condition', NEPCON WEST 2002, December 13-17, San Jose, USA, 2002.

A. Kujala, T. Reinikainen, and W. Ren, 'Transition to Pb-free Manufacturing Using Land Grid Array Packaging Technology', ECTC 2002, May 28-31, San Diego, 2002.

B. Rodgers, J. Punch, J. Jarvis, P. Myllykoski, and T. Reinikainen, 'Finite-element Modeling of a BGA Package Subjected to Thermal and Power Cycling', ITHERM 2002

CARDOSO, I. A. P. ; SOUZA, G. F. M. ; BELHOT, R. V. . Aplicação do Método de Decisão AHP para Seleção da Política de Manutenção de Sistemas Mecânicos (AHP Decision Making Method application to select Maintenance Policies for Mechanical Systems). In: Congresso Nacional de Engenharia Mecânica, 2002, João Pessoa, 2002.

FREITAS, G. G. . Parametric optimization of stayed bridges. In: Encontro de Usuários de Ansys 2002 Smarttech, 2002, São Paulo. Encontro de Usuários de Ansys 2002 Smarttech, 2002.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Stability of polypropylene submitted to multiple extrusion cycles. In: CBECIMAT - Congresso Brasileiro de Engenharia e Ciencia dos Materiais, Natal/RN, Brazil, 2002.

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, and T. Reinikainen, 'Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending', Trans. ASME J. Elec Pack, Vol. 123, Sept, 2001, pp 302-308.

T. Reinikainen and W. Ren, 'An Optimized Shear Test Sample for Assessing Solder Deformation Properties', EuroSimE 2001, April 9-12, Paris, 2001.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . Design of Housing for Safety Valves. 2001.

CARDOSO, I. A. P. . Maintenance Planning for Food Processing Plant. 2001.

FREITAS, G. G. . Automation of the structural verification of gantry cranes. In: Encontro de Usuários de Ansys 2001 Smarttech, 2001, São Paulo. Encontro de Usuários de Ansys 2001 Smarttech, 2001.

FREITAS, G. G. ; COLALILLO, R. . Optimization of metallic structures. In: Congresso SAE 2001, 2001, São Paulo. Congresso SAE 2001, 2001.

SILVA, O. C., DEMARQUETTE, N. R., VILLOUTREIX, G., VILLOUTREIX, J., MAZZA, M., Impact properties of injection molded polyolefins. In: Congresso Brasileiro de Polimeros/ International Macromolecular Colloquium, Gramado/ RS, Brazil. CD ROM, ABPOL, 2001.

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, T. Reinikainen, 'Effect of Bending on Chip Scale Package Interconnects', Trans. ASME J. Elec. Pack., Vol. 122, June, 2000.

V. Pennanen, M. Tammenmaa, T. Reinikainen, J. Zhu, W. Lin, 'TBGA Reliability in Telecom Environment', Soldering and Surface Mount Technology, Vol. 12, No. 2, 2000, pp. 42-46.

J.H. Okura, S. Shetty, B. Ramakrishnan, A. Dasgupta, J. F. J. M. Caers, and T. Reinikainen, 'Guidelines to Select Underfills for Flip Chip on Board Assemblies and Compliant Interposers for Chip Scale Package Assemblies', Special Issue of: Microelectronics Reliability Journal, March, 2000.

SOUZA, G. F. M. ; CARDOSO, I. A. P. . Realibility Concepts Applied to Failure Analysis and Maintenance Policies Elaboration. Boletim técnico da Escola Politécnica da USP. BT/PMR, v. 0010, p. 1-12, 2000.

FREITAS, G. G. . Tridimensional parametric analysis of hydraulic gates Análise Paramétrica Tridimensional de Comportas Hidráulicas. In: 18o Congresso Nacional de Transportes Marítimos e Construção Naval e Offshore 2000, 2000, Rio de Janeiro. 18o Congresso Nacional de Transportes Marítimos e Construção Naval e Offshore 2000, 2000.

FREITAS, G. G. . Parametric Model Generator for Opening in Submarines Structural Hulls. In: Computational Methods for Shell and Spatial Structures IASS-IACM 2000, 2000. Computational Methods for Shell and Spatial Structures IASS-IACM 2000, 2000.

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J.F.J.M. Caers, 'Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2 - With Underfill', Trans. ASME J. Elec. Pack., December, 1999, Vol. 121, pp. 237-241.

K. Darbha, J. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. Caers, éEffect of Curing-Induced Hydrostatic Stresses on Life of Underfilled Area-Array Solder Interconnectsé, InterPACK é99, June 13-19, Hawaii, 1999, pp. 1913-1920.

T. Reinikainen and J. Kivilahti, éDeformation Behaviour of Dilute SnBi(0.5...6at%) Solid Solutionsé, Metallurgical and Materials Transactions A, Vol. 30A, January, 1999, pp. 123-132.

CARDOSO, I. A. P. ; SOUZA, G. F. M. . Reliability Based Maintenance: Science and Solutions. In: XI Congresso Brasileiro de Engenharia Mecânica, 1999, Águas de Lindóia, 1999.

FREITAS, G. G. . Parametric finite element model of hydraulic gates and overhead cranes. 1997.

SILVA, O. C., Freire, J. T., Study on thermal behavior of post-consume poliethylene terephtalate (PET) bottles for recycling. In: Congresso Brasileiro de Sistemas Particulados, Sao Carlos/ SP, Brazil, 1997.

T. Reinikainen, F.W. Wulff, W. Kolbe and T. Ahrens,éA new method to determine crack shape and size in solder jointsé, Trans. ASME J. Elec. Pack., Vol. 117, December, pp. 266-269, 1995.

CARDOSO, I. A. P. . Maintenance Outcomes over the Global Enterprise. Metalurgia e Materiais, São Paulo, v. 50, p. 15-18, 1994.

ROCHA, A. C., SILVA, O. C., Duarte, M. M. L., Numerical simulation of auto-catalytic reactions. In: COBEQ - Congresso Brasileiro de Engenharia Quimica, Sao Paulo/SP, Brazil, 1994.

CARDOSO, I. A. P. ; BELHOT, R. V. . Maintenance Outcomes over the Global Enterprise. In: VI Seminário De Construção e Manutenção de Máquinas, 1993, Santos, 1993.