The scope of "Mechanics & Eletronic Assemblies" (M&EA) area is electronics and electro-mechanics component and manufacturing technologies and life-cycle assessment. M&EA is focused on:
* New electronics integration and manufacturing technologies and miniaturization enablers;
* Quality and reliability, related assessment methods and test equipment design;
* Environmental sustainability and life-cycle assessment;
* Testing, analysis, and consulting services;
M&EA is formed by a multi-disciplinary team with mechanical, electrical, and materials scientists, engineers and technicians.
M&EA research is focusing on new materials, technologies, and manufacturing processes that enable further miniaturization of microelectronic devices. Flexible and wearable electronics will allow for design of completely new types of product concepts, related specifically to mobile communication.
We develop testing and simulation methodologies to facilitate fast development of new electronic products with high reliability. We develop new methodologies and operating procedures to improve quality of electronics manufacturing.
We conduct research on understanding the environmental impact of the life-cycle of electronic products and also search for opportunities to evaluate and develop environmentally friendly materials and re-cycling procedures of electronic products.